JPH0353431Y2 - - Google Patents
Info
- Publication number
- JPH0353431Y2 JPH0353431Y2 JP1987074584U JP7458487U JPH0353431Y2 JP H0353431 Y2 JPH0353431 Y2 JP H0353431Y2 JP 1987074584 U JP1987074584 U JP 1987074584U JP 7458487 U JP7458487 U JP 7458487U JP H0353431 Y2 JPH0353431 Y2 JP H0353431Y2
- Authority
- JP
- Japan
- Prior art keywords
- partition plate
- case
- circuit board
- printed circuit
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005192 partition Methods 0.000 claims description 40
- 239000004020 conductor Substances 0.000 claims description 32
- 230000001105 regulatory effect Effects 0.000 claims description 8
- 238000003780 insertion Methods 0.000 description 12
- 230000037431 insertion Effects 0.000 description 12
- 238000005476 soldering Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987074584U JPH0353431Y2 (en]) | 1987-05-19 | 1987-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987074584U JPH0353431Y2 (en]) | 1987-05-19 | 1987-05-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0166762U JPH0166762U (en]) | 1989-04-28 |
| JPH0353431Y2 true JPH0353431Y2 (en]) | 1991-11-21 |
Family
ID=31299689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987074584U Expired JPH0353431Y2 (en]) | 1987-05-19 | 1987-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353431Y2 (en]) |
-
1987
- 1987-05-19 JP JP1987074584U patent/JPH0353431Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0166762U (en]) | 1989-04-28 |
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